Silicon ingots are sliced down and wafers come out.Wafer thickness is generally 0.15mm or less. They are easily damaged if you just slightly bend them.
Handling of these wafers and solar cells is very delicate as it is in semiconductor production. But it must be cared till they are made modules including adding circuits and connecting cells.
Smooth and flat surface of steel belts is evaluated in this process. Sometimes perforated steel belts are employed to position wafers and cells precisely by suction.
Smooth and flat surface of steel belts is evaluated in this process. Sometimes perforated steel belts are employed to position wafers and cells precisely by suction.
Series 1. Solar power generation and steel belt
No 2. Handling of silicon wafer and solar cells on steel belts
No 2. Handling of silicon wafer and solar cells on steel belts
